ENGINEERING OF WASTE PODANG MANGO SEED FILM AND EPOXY AS COMPOSITE MATERIAL

REKAYASA LIMBAH SELAPUT BIJI MANGGA PODANG DAN EPOKSI SEBAGAI MATERIAL KOMPOSIT

Authors

  • Ahmad Dony Bahtiar polinema

DOI:

https://doi.org/10.33795/j-meeg.v2i2.6551

Keywords:

Podang manggo, tensile test, epoxy

Abstract

Mango Podang, a fruit with a combination of sweet and fresh flavors. Guaranteed not to cause coughing or sore throat when enjoyed. In fact, it is reported that the contents of Podang mango will not cause stomach ache or cough no matter how much you consume it. This mango, which can only be found in the agricultural area on the slopes of Mount Wilis, Kediri Regency, has often been exhibited abroad, because this fruit is only found in Kediri Regency. Until now, only the fruit has been used properly, however, the podang manga seed waste has not been used properly, resulting in waste that is just thrown away. Seeing these conditions, researchers will recycle the waste into composite materials that are combined with epoxy to become new materials that have better mechanical capabilities and can be used for various equipment according to the results of tensile strength tests. This research examines the manufacture of composites from membrane seed fibers of podang manga with epoxy resin. Based on the results of the research data carried out, the highest tensile strength results were found in the Podang mango seed membrane fiber composite made using the hand lay up method, namely at a volume fraction of Podang mango seed membrane fiber of 30% with an average tensile strength value of 28.43 MPa, while The lowest tensile strength in the volume fraction of the podang mango seed membrane fiber was 10% with an average tensile strength value of 20.47 MPa

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Published

23-11-2024

How to Cite

Bahtiar, A. D. (2024). ENGINEERING OF WASTE PODANG MANGO SEED FILM AND EPOXY AS COMPOSITE MATERIAL: REKAYASA LIMBAH SELAPUT BIJI MANGGA PODANG DAN EPOKSI SEBAGAI MATERIAL KOMPOSIT. Jurnal Teknik Mesin, 2(2), 258–262. https://doi.org/10.33795/j-meeg.v2i2.6551